General:
Name: pdf
Format: pdf
Size: 74.84 MB
Book:
Title: Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author: John Lau ยท Xuejun Fan
Language: English
Year: 2025
Subjects: N/A
Publisher: Springer
ISBN: 9819641659
Total pages: 662
Description:
N/A
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