Reddy V Recent Trends in VLSI and Semiconductor Packaging 2025
General:
Name: Reddy V Recent Trends in VLSI and Semiconductor Packaging 2025
Format: pdf
Size: 109.47 MB
Book:
Title: Recent Trends in VLSI and Semiconductor Packaging
Author: T.Vasudeva Reddy
Language: polski
Year: 2025
Subjects: Computers, Computer Programming, Programming – General & Miscellaneous
Publisher: CRC Press
ISBN: 9781040361641
Total pages: 651
Description:
The International conference on Semiconductor Materials packaging, AI&ML, Reconfigurable VLSI architectures for IoT, future Communication Technologies (“SMART-2024”) aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields. “SMART-2024” seeked to foster collaboration, innovation, and knowledge dissemination by bringing together experts and stakeholders from diverse backgrounds to address key issues and explore new research directions. The conference targeted a diverse audience including researchers, academicians, scientists, engineers, technologists, industry professionals, students, policymakers, and other stakeholders interested in VLSI, IoT, AI-ML, communication systems, semiconductor packaging, hetero architecture devices, and Nano materials.
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