Lau J Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology 2024
General:
Name: Lau J Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology 2024
Format: pdf
Size: 32.05 MB
Book:
Title: Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Author: John H. Lau
Language: angielski
Year: 2024
Subjects: N/A
Publisher: Springer-Verlag New York, LLC
ISBN: 9789819721405
Total pages: 515
Description:
This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics.
The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.
Download from RapidGator
https://rapidgator.net/file/85a33f68b7e37e00e6dd27f9b6a606fa/yp6405l5eu27hv5ez84uuo.pdf