Encyclopedia of Cell Technology
General:
Name: Encyclopedia of Cell Technology
Format: pdf
Size: 141.47 MB
Book:
Title: 3D IC Stacking Technology
Author: Banqiu Wu
Language: polski
Year: 2011
Subjects: Technology, Nonfiction
Publisher: McGraw-Hill Education
ISBN: 9780071741958
Total pages: 1422
Description:
The latest advances in three-dimensional integrated circuit stacking technology
With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.
3D IC Stacking Technology covers:High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology
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